Rochester Electronics has been chosen by the Microelectronic Packaging organization within the Microsystems Engineering, Science and Applications (MESA) division at Sandia National Labs (SNL) as one of its key external testing suppliers after Rochester’s successful completion of HBT (Heterojunction Bipolar Transistor) environmental and reliability (QCI) testing program in 2020.
“We are delighted to be selected as a key supplier by Sandia National Labs. This program leverages Rochester’s strong reliability testing capabilities, both in terms of facilities and engineering skills, and we look forward to a long-term partnership,” said Mike Dube, VP Manufacturing and Engineering, Rochester Electronics
This organization within Sandia Labs is responsible for qualification testing of Application-Specific Integrated Circuits (ASIC) devices in applications such as sensors, photonics, and MEMS (Micro Electromechanical Systems) components.
Sandia Labs is one of the keys Federally Funded Research and Development Centers (FFRDC) protecting US national security and supporting numerous federal, state, and local government agencies, companies, and organizations.
Starting in July 2021, Rochester’s Engineering team will support SNL with environmental and reliability (QCI) testing of ceramic packages, specifically:
- 56CQFN ceramic package (Mil-Std-883 B&D testing)
- 56CQFN ceramic package (PIND, Fine/Gross Leak screen testing)
- 48CQFJ ceramic package (Mil-Std-883 B&D testing)
- 48CQFJ ceramic package (Fine/Gross Leak screen testing)
- 68CQFJ ceramic package (Mil-Std-883 B&D testing)