SABIC Offers New LNP™ Compound for 5G Dipole Antennas
In an era of increasing urbanization and smart cities, broad availability of 5G networking is urgently needed to provide fast, reliable connectivity for millions of residents.
SABIC has announced LNP™ THERMOCOMP™ OFC08V compound, a material well suited for 5G base station dipole antennas and other electrical/electronic applications.
This new compound can help the industry develop lightweight, cost-effective, all-plastic antenna designs that facilitate the deployment of 5G infrastructure. In an era of increasing urbanization and smart cities, broad availability of 5G networking is urgently needed to provide fast, reliable connectivity for millions of residents.
“To help achieve 5G’s promise of faster speeds, increased data loads and ultra-low latency, RF antenna manufacturers are revolutionizing their designs, materials and processes,” said Joshua Chiaw, Director, Business Management, LNP & NORYL, Specialties, SABIC. “We are helping our customers simplify the production of RF antennas, which are used by the hundreds in arrays within active antenna units. Our latest high-performance LNP THERMOCOMP compound not only helps streamline manufacturing by avoiding post processing, but it can also deliver exceptional performance across multiple, critical areas. By continually developing new materials for 5G infrastructure, SABIC aims to accelerate expansion of this next-generation networking technology.”
LNP THERMOCOMP OFC08V compound is a glass fiber-reinforced material based on polyphenylene sulfide (PPS) resin. It features excellent plating performance using laser direct structuring (LDS), strong layer adhesion, good warpage control, high heat resistance, and stable dielectric and radio frequency (RF) performance. This unique combination of properties could enable an injection moldable new dipole antenna design, offering advantages over traditional printed circuit board (PCB) assembly and the selective electroplating of plastic.
