Sahasra Semiconductors Private Limited was one of among the 22 companies committed to invest further in India to fuel electronics manufacturing. These investments were announced after India introduced the PLI scheme to fuel investments and to establish India as a smartphone export hub.
Now according to the latest tweet by Electronics Sector Skills Council of India (ESSCI) which is a Not-for-Profit Organization; Sahasra Semiconductors Private Limited laid the foundation of India’s first NAND Flash IC packaging facility.
Sahasra is known for manufacturing electronics parts. Sahasra earlier announced an investment of Rs 350 crore over the next four years for assembling mobile phone memory chipsets, laptop hard drives and motherboards in India with two new manufacturing facilities coming up in Rajasthan and UP.
Sahasra group managing director Amrit Manwani earlier stated that an investment of Rs 140 crore to produce 40 million ICs annually is enroute. The plant is being set up in Bhiwadi, Rajasthan.
The company has ambitious targets to scale up to 100 million IC units annually.
Sahasra (meaning ‘millenia’) was established in the year 2000 for manufacturing electronic products, has till now expanded to four facilities in the NCR, India, one unit in Rwanda, Africa and eight sales and marketing offices in India, the US, Canada, Africa and Europe.
As per government statistics for applications to the Rs 41,000-crore PLI scheme, 22 companies have sought incentives.
Out of these, five international players- Samsung, Foxconn – through two units, Wistron and Pegatron and five domestic players- Lava, Dixon, Micromax, Padget Electronics, Sojo and Optiemus will be aided by the government to develop their manufacturing ecosystem in India.
The Memory Packaging Market was valued at USD 22.71 billion in 2019 and is expected to reach a value of USD 31.03 billion by 2025, at a CAGR of 5.5%, over the forecast period. NAND Flash IC Packaging market has been witnessing a boom because of mobile and the computing (mainly servers).