SAN JOSE, USA: SEMI, the global industry association intended for companies that supply manufacturing technology and materials to the world’s chip makers, informed that worldwide sales of semiconductor manufacturing equipment totaled $31.58 billion in fiscal 2013, representing a year-over-year decrease of 14 percent, that is.
The data is available in the Worldwide Semiconductor Equipment Market Statistics (SEMS) Report, courtesy, SEMI.
Accumulated from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is but a summary of the monthly billings and bookings figures aimed at the global semiconductor equipment industry.
The report, which takes account of data meant for seven major semiconductor producing regions and 24 product categories, shows worldwide billings totaled $31.58 billion in fiscal 2013, compared to $36.93 billion in sales posted in 2012. Categories cover wafer processing, assembly and packaging, test, and other front-end equipment. Other front-end includes mask/reticle manufacturing, wafer manufacturing, and fab facilities equipment.
Spending rates dropped for all the regions tracked in the WWSEMS report, except for for China and Taiwan. For the second year in a row Taiwan stayed as the region with the highest amount of spending with $10.57 billion in equipment sales.
The North American market surpassed South Korea to claim assertion of the second place with $5.26 billion in sales; South Korea fell to the third position with a regional decrease of 41 percent.
The global other front end equipment segment plummeted to 34 percent; the assembly and packaging segment reduced to 26 percent; total test equipment sales declined to 24 percent; and the wafer processing equipment market segment decreased to 11 percent.