Semiconductor Component
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Epson’s Printer Named for The EdTech Awards 2021
Epson‘s WorkForce ST-2000 color multifunction Supertank printer has been recognized as the EdTech Awards 2021 finalist under The EdTech Cool…
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Honeywell Earns DARPA’s Contract for Water Extraction Tech
Honeywell-led team has secured a contract from the Defense Advanced Research Projects Agency (DARPA), part of the United States Department…
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Vishay’s Thermawick THJP Now at New York Electronics
New Yorker Electronics has introduced Vishay’s ThermaWick THJP Series of Surface-mount Thermal Jumper Chips. The Vishay Dale Thin Film device…
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DriSteem Launches New Buyer’s Guide for Laboratories
DriSteem, the leading manufacturer of humidification, evaporative cooling, and water treatment products, has released a new buyer’s guide that focuses…
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NXP Appoints New Executive Vice President
NXP Semiconductors has appointed Andy Micallef as the NXP’s Executive Vice President, Global Operations. In this role, Micallef will be…
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FLIR’s Ground Robots Gained New Orders from US Military
FLIR Systems has gained more than $70 million in the new orders for its advanced ground robots from the U.S.…
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Kyocera Wins Japan’s 2021 Science and Technology Award
Kyocera Corporation has won the 2021 “Science and Technology Award (Development Category)” by Japan’s Ministry of Education, Culture, Sports, Science,…
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Panasonic to Host Global Webinar for IoT Era
Panasonic Corporation has announced that the company will be hosting a global webinar under the title of “New Opportunities in…
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MediaTek Presents New Dimensity 900 5G Chipset
MediaTek has introduced new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset,…
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