Semiconductor Component
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Panasonic’s Next-Gen BPL Communication Technology Adopted as IEEE 1901a Standard
Panasonic Corporation announced that the IEEE Standards Association has approved the company’s next-generation broadband over powerline (BPL) communication technology for…
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Phoenix Contact’s QUINT POWER Line Achieves SIL 3 Without External Redundancy
Phoenix Contact is expanding the limits of safety and availability. Phoenix Contact’s premium QUINT POWER line now includes a single-device…
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Infineon Pioneers Regulator Solution for Next-Gen AI and 5G Networking
Infineon Technologies extends its portfolio of high current system chipset solutions with the industry’s first 16-phase digital PWM multiphase controller,…
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Digi-Key Rolls Out New Supplier-Driven KiCad Library
Digi-Key Electronics announced the release of a new secondary KiCad library, known as the Digi-Key Partner Library, on GitHub. This…
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Making Roads Safer with V2X Wireless Technology
To make roads safer, improve autonomous driving, and further the aims of the smart city, one particularly important field is…
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Indium Corporation Rollsout InFORMS ESM02 for Die-Level Bonding
Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level…
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Mouser Electronics Ships High-Voltage Digital-to-Analog Converters From TI
Mouser Electronics ships DACx1416 digital-to-analog converters (DACs) from Texas Instruments (TI). The DACx1416 are a pin-compatible family of 16-channel, buffered,…
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ST’s Water-Resistant MEMS Pressure Sensor for Consumer and Industrial Applications
The STMicroelectronics LPS33W water-resistant MEMS pressure sensor combines chemical compatibility, stability, and accuracy for use in a wide range of applications such…
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MPLAB Harmony v3 Unifies Software Development Framework for PIC and SAM MCUs
To help developers simplify and scale designs, Microchip Technology has announced a unified software framework MPLAB Harmony version 3.0 9…
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