Toshiba Memory Corporation has begun sampling of their new Automotive JEDEC UFS Version 2.1 embedded memory solutions utilizing 3D flash memory. The new products are embedded flash memory devices that integrate the company’s BiCS FLASH 3D flash memory and a controller in a single package.
The sequential read and write performance are improved by approximately 6 percent and 33 percent, respectively, over the existing device.
The company’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the enhanced reliability required by various automotive applications. The lineup consists of four capacities: 32GB, 64GB, 128GB, and 256GB.
The Key Features of the new UFS devices include:
The new UFS devices feature several functions well-suited to the requirements of automotive applications, including Refresh, Thermal Control and Extended Diagnosis.
- Refresh function can be used to refresh data stored in UFS, and helps to extend the data’s lifespan.
- Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications.
- Extended Diagnosis function helps users easily understand the device’s status.
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