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Indium Corporation Features Indium3.2HF Solder Paste at SEMICON Taiwan

Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications.

indium paste

Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan.

Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation’s Type 6SG powder is ideal for fine feature printing applications.

Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

  • Good response-to-pause
  • A wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, visit Click here or visit Indium Corporation’s booth J224

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