Indium Corporation announces that the company will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Indium Corporation’s soldering materials for HIA and SiP applications touts to have a proven track record of success in more than 2 billion front-end module SiP devices manufactured in the last three years using the company’s materials.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets.
Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
See Indium Corporation’s experts at the show or visit the company’s HIA page at: Click here.
For more information about Indium Corporation: Click here