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IDT, Telink Semiconductor Team Up for Integrated Sensor Platforms

IDT's sensor platform with Bluetooth capability is sampling in 1CQ2019 with integrated high performance, low-power connectivity powered by Telink Semiconductor.

IDT and Telink

Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications. These platforms enable a wide variety of IoT use cases, such as environmental sensing, health and fitness monitoring, connected smart buildings, as well as asset identification, position and location tracking.

IDT plans to release the new Bluetooth Low Energy 5 module featuring Telink’s 32-bit microcontroller core with better power-balanced performance for battery-operated devices. The Bluetooth module has an integrated 2.4GHz RF transceiver supporting the IEEE802.15.4 multi-standard wireless protocol along with audio support.

“We are excited about Telink’s technology and how it will augment our existing sensor technology and connectivity platform,” said Sailesh Chittipeddi, IDT’s executive vice president for global operations and chief technology officer. “With this partnership, we will be able to address markets together that we weren’t fully capable of with our standalone solutions.”

“IDT’s integrated sensors and applications combined with Telink’s third generation, ultra-low power connectivity ICs – specifically designed to enable cost sensitive applications – give high-performance options without compromise to connected sensing product designers,” said Jim Wargnier, global VP of sales for Telink Semiconductor. “We look forward to pushing the boundaries with IDT on this exciting platform.”

Web for IDT idt.com.

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