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Infineon New Top-Side Cooled SMD Solution Double DPAK Launched Aimed at High-Power Applications

Infineon Technologies has recently launched Double DPAK - the first top-side cooled SMD package. This new packaging solution enables fast switching and high efficiency in reduced size and weight with a minimized total cost of ownership.

Infineon Technologies

The need of higher power and more efficiency in smaller space is challenging for design parameters for high power supplies.  Semiconductor devices are essential to the operation and performance of modern switched mode power supplies (SMPS).

Over the last years, a trend towards surface mount devices (SMD) has been emerging. Thermal management of the present-day SMD-based SMPS designs still remains a barrier to efficiency.

Infineon Technologies has recently launched Double DPAK – the first top-side cooled SMD package. This new packaging solution enables fast switching and high efficiency in reduced size and weight with a minimized total cost of ownership.

The innovative top-side cooled package exceeds the industry’s quality requirements. Thanks to the innovative top-side cooling concept, it further shapes the high power SMPS market. The features of DDPAK get combined with the benefits of the already existing high voltage technologies of 600V CoolMOS G7 SJ MOSFET and CoolSiC Schottky Diode 650V G6. The thermal decoupling of the printed circuit board and semiconductor enables higher power density or longer system lifetime.

DDPAK offers industry-leading performance as an SMD alternative for high power SMPS designs. Its four-pin configuration allows for separate pin source-sense to deliver undisturbed signal to the driver. Thus, it provides higher efficiency at full load.

Infineon enables optimized system solutions for high power designs by combining its CoolMOS G7 with CoolSiC G6 and EiceDRIVER families.

Key Nuggets

  • The features of DDPAK get combined with the benefits of the already existing high voltage technologies of 600V CoolMOS G7 SJ MOSFETand CoolSiC Schottky Diode 650V G6.
  • The thermal decoupling of the printed circuit board and semiconductor enables higher power density or longer system lifetime.
  • DDPAK flaunt extended performance as an SMD alternative for high power SMPS designs.
  • Its four-pin configuration allows for separate pin source-sense to deliver undisturbed signal to the driver. Thus, it provides higher efficiency at full load.
  • Infineon enables optimized system solutions for high power designs by combining its CoolMOS G7 with CoolSiC G6 and EiceDRIVER

Availability
600V CoolMOS G7 SJ MOSFET and CoolSiC Schottky Diode 650V G6 with DDPAK packaging are available now. Further info can be found here: infineon.
Infineon at the PCIM 2018
At the PCIM 2018 tradeshow Infineon is presenting leading edge technology for efficient systems in industrial, consumer and automotive applications. Infineon’s demos for empowering a world of unlimited energy are presented at booth #412 in hall 9 (Nuremberg, Germany, 5-7 June 2018). Information about the PCIM show highlights is available at: Click here.

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Niloy Banerjee

A generic movie-buff, passionate and professional with print journalism, serving editorial verticals on Technical and B2B segments, crude rover and writer on business happenings, spare time playing physical and digital forms of games; a love with philosophy is perennial as trying to archive pebbles from the ocean of literature. Lastly, a connoisseur in making and eating palatable cuisines.

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