Vishay Intertechnology announces that the company’s T58 series of vPolyTan polymer surface-mount chip capacitors has been named a UBM 2016 EE Times and EDN ACE Award finalist in the Ultimate Products: Passives, Interconnects, and Electromechanical category.
Designed to deliver increased volumetric efficiency for handheld consumer electronics, T58 series devices combine polymer tantalum technology with Vishay’s high-efficiency MicroTan packaging to achieve industry-best capacitance-voltage ratings in six molded case codes, including 47µF-6.3V in the compact M0 (1608-10) case and 220µF-10V and 330µF-6.3V in the BB (3528-20).
The EE Times and EDN ACE Awards is sought to be one the prime awards in the electronics industry, finalists for the Ultimate Products — awarded to the most significant electronic products introduced between Jan. 1, 2015, and June 30, 2016 — were judged in 12 categories by a panel of EE Times and EDN editors, as well as industry experts.
Leveraging patented MAP (multi-array packaging) assembly technology, T58 series capacitors provide a 25 % improvement in space utilization compared with similar devices, saving PCB space and enabling the design of smaller and thinner end products, including smartphones, tablets, and ultra-thin laptops, in addition to wireless cards, network equipment, and audio amplifiers and pre-amplifiers. In these devices, T58 series capacitors are intended for decoupling, smoothing, filtering, and energy storage applications.
The devices offer capacitance from 10 µF to 330 µF, with capacitance tolerance of ± 20 %, overvoltage ratings from 4 V to 25 V in the MM (1608-09), M0 (1608-10), W9 (2012-09), A0 (3216-18), AA (3216-18), B0 (3528-10), and BB (3528-20) case codes. The capacitors feature low impedance, low ESR from 50 mΩ to 500 mΩ at +25 °C and 100 kHz, and ripple current from 0.224 A to 1.30 A at 100 kHz, and they operate over a temperature range of -55 °C to +105 °C with voltage derating above +85 °C.
Final winners will be announced at the ACE Awards event, taking place on Dec. 7 in San Jose, California, during Embedded Systems Conference (ESC) Silicon Valley.