Vicor Corporation has now announced a new Power-on-Package (“PoP”) ChiP-set which includes Modular Current Multipliers (“MCMs”) tailored for high-performance GPU, CPU, and ASIC (“XPU”) processors.
Power-on-Package is an enabling technology for high current Artificial Intelligence (“AI”) processors and 48V autonomous driving systems.
PoP MCMs multiply current and divide voltage from a 48V source in close proximity to XPUs touts to enable higher levels of XPU performance.
Power distribution efficiency and system density rise beyond the limitations of conventional 12V input multi-phase voltage regulators lacking current multiplication.
Power-on-Package modules build upon Factorized Power Architecture (FPA) systems deployed in high-performance computers and large-scale datacenters. FPA supports efficient power distribution and direct conversion from 48V to sub-1V XPUs. With current multiplication deployed in close proximity to high current processors, PoP MCMs overcome previous barriers to improved performance.
A pair of MCM4608S59Z01B5T00 (MCMs) and a MCD4609S60E59H0T00 Modular Current Multiplier Driver (MCD) provide:
- 600A continuously and up to 1,000A peak at up to 1V.
- Owing to their high density, low profile package (46 x 8 x 2.7mm) and low noise attributes, MCMs are suitable for co-packaging within the XPU substrate or adjacent to it.
- Close proximity to the XPU eliminates substantial power loss and bandwidth limitations incurred in the “last inch” of the current delivery path from the boundaries of 12V multi-phase regulators.