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SET with TAIPRO Engineering Introduce ACCµRA M

The first demonstration machine, installed by SET in the TAIPRO ENGINEERING clean room is an ACCµRA M. This easy to use Flip-Chip bonder is popular with research centres and universities. It allows manual alignment and assembly of components with an accuracy of 3 µm.

Flip-chip bonding is a component assembly technology used in high-precision, high-density electronic connections.

Based in Liège, Belgium TAIPRO ENGINEERING assembles its customer’s components, either as tests or mini-production. As a micro-manufacturing specialist, TAIPRO will also receive SET customers who need other micro-manufacturing services that TAIPRO offers (stud bumping, shear test, etc.).

A bigger footprint in the European market

Located in the heart of Europe, this new demonstration centre is designed for customers in the Benelux region. “It responds to a growing demand for ultra-precise component assembly equipment for research in Europe.”, said Pascal Metzger, SET CEO.

“It also responds to a need, on the one hand for an increasing miniaturization of components and on the other to mix different micro-assembly techniques so as to obtain innovative and robust solutions for very demanding environments. This is a unique opportunity to open up to these new markets.”, said Michel Saint-Mard, Managing Director of TAIPRO ENGINEERING.

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Nitisha Dubey

I am a Journalist with a post graduate degree in Journalism & Mass Communication. I love reading non-fiction books, exploring different destinations and varieties of cuisines. Biographies and historical movies are few favourites.

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