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ST Ships 100 Million STB Chipsets in Indian Homes


STMicroelectronics announces that it has successfully shipped its 100 millionth chipset for digital cable and satellite set-top boxes (STB) in India.

Ted Grauch, Vice President Global Marketing, Consumer Product Division, STMicroelectronics, said, “This key milestone highlights ST’s strong engagement in India and the competitiveness of our SoC portfolio that has been recently expanded with a new generation of innovative HD and Ultra-HD devices.”

ST’s products have set high standards in the Indian digital STB market for their quality, performance, high reliability, and total cost of ownership. ST solutions greatly improve the end-user experience for linear and on-demand Pay-TV services.

Announced at IBC 2015, ST’s HD HEVC Liege3 chipsets deliver up to five times the performance compared with previous HD SoC generations and range from entry-level 3K DMIPS up to 6K DMIPS with embedded GPU. Raising the bar in entry and mid-range broadcast set-top boxes and Internet Protocol (IP)clients, the Liege3 SoC family is composed of satellite variants (STiH337/STiH332), cable-market products (STiH372), and IPTV set-top-box devices (STiH307/STiH302).

Bundle solutions are available on the Liege3 family for connected and Personal Video Recorder (PVR) STBs, significantly reducing the time required for an OEM to deliver an operator product.

Addressing the satellite markets, the STiH337/STiH332 SoCs implement a new DVB-S2X demodulation scheme enabling Service Operators to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity.

During Convergence India 2016, ST is demonstrating its latest STB products for HD (Liege3 SoCs) and Ultra-HD (Cannes/Monaco 4K SoC) markets.

Technology demonstrations will be accessible by invitation in ST’s private suite (Drawing Room) at Hotel Oberoi in New Delhi, January 20 – 22, 2016.


BiS Team

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