ST, Virscient to Enable Faster Delivery of Connected-Car Systems
Virscient offering to provide wireless connectivity expertise to ST automotive customers for accelerated time-to-market of secure, connected products
STMicroelectronics announces to join forces with Virscient. Under this agreement, Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP).
MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles.
Virscient brings a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.
The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides an excellent platform for connectivity within the vehicular environment.
“We chose to collaborate with Virscient for Telemaco3P-based designs because of their differentiated expertise in the development of embedded systems and wireless technologies, and their proven track record of helping customers take connected products from concept to market,” said Philippe Prats, Head of EMEA Marketing and Application for STMicroelectronics’ Automotive and Discrete products. “The Telemaco3P platform enables our customers to deliver new categories and products in automotive telematics. By working with Virscient, we make this exciting technology accessible to a broader range of innovative companies.”
Commenting on the collaboration, Dr. Murray Pearson, CEO of Virscient, said, “We’re thrilled to work with STMicroelectronics to enable more companies to deliver innovative and market-leading platforms using the Telemaco3P devices.”
“ST and Telemaco3P are setting the security standard for processor and connectivity solutions in vehicular telematics. By leveraging Virscient’s hardware and software development capabilities, and our considerable experience with embedded wireless and connectivity technologies, Telemaco3P customers can push the envelope, and get their products to market quicker than ever.”
Further info: www.st.com, www.virscient.com
