By navigating our site, you agree to allow us to use cookies, in accordance with our Privacy Policy.

STMicroelectronics unveils Advanced MEMS Accelerometers Engineered to Withstand Stresses of Modern Mobile Life

India, December 9, 2013 – STMicroelectronics , a global semiconductor trailblazer serving customers across the spectrum of electronics applications besides being the leading supplier of MEMS (Micro-Electro-Mechanical Systems) devices for consumer and mobile applications, has showcased its new, state-of-the-art high-performance MEMS accelerometer engineered to withstand increasingly challenging conditions involving the latest smartphones and other portable devices, following suit.


Given today’s processing of intensive mobile apps coupled with super-slim handset designs, portable electronics happens to be a wee tad bit more vulnerable to thermal variation and bending. As OEMs push to deliver new models to the fore and in the process, supporting ever more precise, stable and for that matter, responsive movement sensing as regards to features reading in the order of inclinometer, gesture recognition, gaming, artificial horizon in cameras, indoor navigation, and last but never the least augmented reality.

ST’s new LIS2HH12 3-axis accelerometer goes on to acquaint the Technological arena with that of an innovative, mechanical structure suffixed with a dedicated processing to be able to deliver unswerving and stable high performance that too in thermally challenging conditions within the gambit and intricacies of ever-slimmer portable applications.

Benedetto Vigna, Executive Vice President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics, had this to say in the wake of the development “The innovative architecture of our new accelerometer represents a significant advance in the very design of MEMS devices.” He went on to volumnise his rhetoric further, by lipping, thus, “This next-generation device caters to the needs of the mobile industry for higher performance along with stability in the realm concerning cutting-edge motion-sensitive applications.”

The LIS2HH12 is housed in an ultra-small 2mm x 2mm x 1mm package, facilitating designers with extra flexibility to relevantly encounter pc-board layout rules for wireless handsets while helping achieve all along a low overall handset profile. It is noteworthy to have this slight headcount of sorts, in here, when the accelerometer at the offing shows the inclusion of features such as selectable, full-scale range of ±2, ±4 or ±8 g and a 16-bit digital output, followed by an integrated temperature sensor, industry-standard I2C and SPI interfaces, a wide analog supply-voltage range of 1.71V to 3.6V and two programmable interrupt generators that helps to streamline system design.

Encapsulated with typical Zero-g level change versus temperature of ±0.25mg/C, the stability of the LIS2HH12 has improved twice compared with the previously announced devices. Also, the rejection versus bending with a typical offset accuracy of ±30mg has improved by 25% over the existing solutions. All said and done, the LIS2HH12 is board- and  software-compatible with ST’s recently announced LSM303C 2mm x 2mm MEMS eCompass module, enabling OEMs to create differentiated handset products economically by leveraging common hardware and software. Alternatively, the LIS2HH12 accelerometer can be used with ST’s LIS3MDL standalone magnetic sensor to create an eCompass using discrete components.

Engineering samples of the LIS2HH12, in the 2mm x 2mm x 1mm LGA-12 package, are available now. Volume production of the same is expected to start in Q1 2014, with unit set at a price of $0.90 for quantities of 1,000 pieces approximately.


Jawed Akhtar

A Journalist by interest and a Music Enthusiast by passion. Wedded to Mother Nature, Jawed indulges his aesthetics in travelling and reading books of varied genres. Having covered News stories for top Dailies in his formative years, that is, he is game for tryst with Technology at Techmagnifier.

Related Articles

Upcoming Events