3D
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Yokogawa Signs Partnership Agreement with InSphero
Yokogawa Electric Corporation has signed a partnership agreement with InSphero AG. The two companies aim to establish and advance methods…
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3D Electronics: An Alternative to PCBs?
Mention an electronic circuit and you are likely to picture a printed circuit board (PCB): a rigid rectangle in a characteristic green color with copper lines…
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GTTC Partners with Dassault Systèmes for four 3DEXPERIENCE Innovation Centres in Karnataka
Dassault Systèmes and Government Tool Room & Training Centre (GTTC) has set up four 3DEXPERIENCE Innovation Centres in the districts…
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RS Components Partners with National 3D Printing Society
RS Components has embarked on a partnership with the National 3D Printing Society (N3DPS) in the UK to enable frontline health workers…
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STMicroelectronics Introduces High-Performance Global-Shutter Image Sensors
STMicroelectronics is enabling the next generation of smart computer-vision applications with new high-speed image sensors that use “global shutter” – the…
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Infineon Collaborates with Qualcomm
Infineon Technologies worked with Qualcomm Technologies to develop a reference design for 3D authentication based on the Qualcomm Snapdragon 865…
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Lawrence and Mayo Introduces Advanced Mobile Mapping Solutions to India
LYNX – Lawrence & Mayo has recently introduced the highly-advanced GexCel mobile mapping solutions that are set to bring a…
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SET Introduces New Automatic Flip-Chip Bonder
SET, Smart Equipment Technology has recently announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone…
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Velodyne Lidar’s Sponsorship of Japan Automotive AI Challenge Advances Next Generation Engineers
Velodyne Lidar, Inc. participated as a gold sponsor in the recent Japan Automotive AI Challenge. The university student competition, organized by…
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