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AI computing

Rashmi October 10, 2024
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Infineon Launches High-Density Power Modules for AI Computing

Infineon Technologies AG is launching the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data…
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Nitisha Dubey June 22, 2022
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MediaTek Announces Dimensity 9000+ for 5G Smartphone Chipset

MediaTek has launched the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers…
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