Indium Corporation
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Indium to Present Low-Temp Alloy Durafuse LT
Indium Corporation has recently started featuring the award-winning Durafuse LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications…
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Indium Corporation’s New Flux-Cored Wire at IPC APEX Expo
Indium Corporation has announced its participation at IPC APEX Expo, where it will be showcasing its uniquely formulated flux-cored wire…
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Indium’s New Approved Jetting Solder Paste
Indium Corporation’s newest jetting solder paste, PicoShot NC-5M, has got the official approval from Mycronic as a qualified jetting solder paste. PicoShot…
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Indium Corporation’s Miloš Lazić to be Available at Virtual IPC APEX Expo
Indium Corporation has announced that its Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at…
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Indium’s expert Dr. Lee to present at IMPACT-IAAC 2019
Dr. Lee will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. He will explain the…
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Indium Corporation to Feature Indium8.9HF Solder Paste at China
Indium 8.9HF is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability,…
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Indium Corporation Expert to Present at SiP Conference China 2019
Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will be present at the SiP Conference China 2019, September 10-11, in…
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Indium Corporation Expert Presentation at CSPT 2019
Hu’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used…
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Indium Corporation Veteran to Speak at 2019 ICEPT
Indium Corporation announced that Ning-Cheng Lee, Vice President of Technology, will be sharing his industry expertise at the 20th International…
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