Indium Corporation
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Indium Corporation Rollsout InFORMS ESM02 for Die-Level Bonding
Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level…
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Indium Corporation to Flaunt Indium8.9HF Solder Paste at Productronica China
Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at Productronica China, March 20-22, in Shanghai, China. The Indium8.9HF…
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Indium Corporation to Feature Proven NC-SMQ75 Die-Attach Solder Paste at CSPT 2018
Indium Corporation will feature its Die-Attach “Power-Safe” NC-SMQ75 Solder Paste at China Semiconductor Packaging & Test Seminar (CSPT) 2018, Nov.…
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Indium Corporation to Feature Soldering Materials for HIA at IEEE EPTC Singapore 2018
Indium Corporation announces that the company will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at…
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Indium Corporation Features Indium3.2HF Solder Paste at SEMICON Taiwan
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan. Indium Corporation’s Indium3.2HF…
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