SET
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SUSS MicroTec, SET Inks Collaboration
SUSS MicroTec and SET have recently signed a joint development agreement to develop a cluster, including several modules such as…
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SET Introduces New Automatic Flip-Chip Bonder
SET, Smart Equipment Technology has recently announced the release of NEO HB, an automatic flip-chip bonder designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone…
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