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TE Connectivity Unveils New Sliver Straddle-Mount Connectors

TE Connectivity recently launched its new Sliver straddle-mount connectors, which are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0.

TE ConnectivityA new extension of the Sliver product line, these straddle-mount connectors were designed to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance and improved thermal management.

Sliver straddle-mount connectors for SFF-TA-1002 support high speeds through PCIe Gen 5, with a roadmap to 112G. SFF-TA-1002 is a proposed alternative or replacement to many form factors, including M.2, U.2, and PCIe. The high-density, 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts, which is where current products in the market begin to max out.

OCP NIC 3.0 cards are horizontal and faceplate-pluggable, which helps to increase airflow through the enclosure and enable system ease of design.

Ann Ou, product manager at TE Connectivity, commented, “Our Sliver straddle-mount products deliver high performance and density in a standardized form factor to facilitate design and manufacturing for our data center equipment partners.”

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Jyoti Gazmer

A Mass Comm. graduate believes strongly in the power of words. A book lover who dreams to own a library some day. An introvert but will become your closest friend if you share mutual feelings about COFFEE. I prefer having more puppies over humans.

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