By navigating our site, you agree to allow us to use cookies, in accordance with our Privacy Policy.

Texas Instruments Launch Solderless Robotics Kit For University Education

Reusable kit allows students to build an embedded system in 15 minutes or less.

Texas Instruments introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test.

Texas Instruments

Ideally designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in less than 15 minutes. Classrooms that may not have access to soldering equipment benefit from the solderless, hands-on kit and curriculum that can be reused year after year.

IEEE President and CEOProfessor Jose Moura, unveiled the product along with Doug Phillips, Director of TI’s Global University Program. The new kit includes the industry-leading SimpleLink MSP432P401R microcontroller (MCU) LaunchPad Development Kit, easy-to-connect sensors, and a versatile chassis board that turns the robot into a mobile learning platform. Through accompanying core and supplemental curriculum, students learn how to integrate their hardware and software knowledge to build and test a system. For advanced learning, wireless communication and Internet of Things (IoT) capabilities can be added to the TI-RSLK MAX to remotely control the robot or even establish robot-to robot communication.

Doug Phillips, Director of TI’s Global University Program, said, “With the TI-RSLK MAX, students can quickly understand system concepts as early as their first year through building their own embedded system. This will help create the base knowledge that will benefit students in learning more complex topics covered in the advanced curriculum.”

While addressing the gathering at the launch of the new kit in Bangalore, IEEE President and CEO, Professor Jose Moura said, “Experimentation is what makes an engineer and TI-RSLK MAX is an addition to an already existing robust module, which is expected to reach out to more than 8000 universities across the globe, out of which over 2000 engineering colleges are in India alone. With the numbers rising every day, the potential to expand the reach of this technology is immense.”

Texas Instruments launched the TI-RSLK series last year to help universities across the globe keep students engaged from their first day of class until graduation with hands-on, customizable options for learning embedded systems design.  The TI-RSLK MAX completes all tasks and robotic challenges covered in the classic TI-RSLK Maze Edition kit, such as solving a maze, line following and avoiding obstacles. It also provides a user-friendly assembly of the various sub-systems, speeding up the building and testing of the robot.

The TI-RSLK MAX will be available for purchase in late August and will include the SimpleLink MSP432P401R MCU LaunchPad Development Kit, as well as all additional components required for assembly. To expand kit functionality and learning paths, optional accessories will be available for purchase.

Further information about the TI-RSLK: Click Here


Jyoti Gazmer

A Mass Comm. graduate believes strongly in the power of words. A book lover who dreams to own a library some day. An introvert but will become your closest friend if you share mutual feelings about COFFEE. I prefer having more puppies over humans.

Related Articles

Upcoming Events