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TI Acquires Micron 300-mm Semiconductor Fab

Texas Instruments(TI) has acquired Micron Technology’s 300-mm semiconductor factory (or “fab”) in Lehi, Utah, for $900 million.

TI“This investment continues to strengthen our competitive advantage in manufacturing and technology and is part of our long-term capacity planning,” said Rich Templeton, TI’s Chairman, President and CEO.

“The Lehi semiconductor fab is a great asset and a great team. We are excited about the engineering experience and technical skills the team brings in ramping and manufacturing advanced semiconductor processes,” said Kyle Flessner, TI’s Senior Vice President of Technology and Manufacturing.

The Lehi fab will be TI’s fourth 300-mm fab, joining DMOS6, RFAB1 and soon-to-be-completed RFAB2 in TI’s wafer fab manufacturing operations.

In addition to its value as a 300-mm fab, the acquisition is a strategic move, as Lehi will start with 65-nm and 45-nm production for TI’s analog and embedded processing products and be able to go beyond those nodes as required.

The companies plan to complete the sale by the end of 2021. Related underutilization costs of about $75 million per quarter are expected in 2022. The first revenue is expected in early 2023.

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Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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