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TI to Start Constructing 300-mm Semiconductor Fabs by 2022

Texas Instruments Incorporated (TI) has declared to begin construction of its new 300-millimeter semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas by next year.

TIThe North Texas site has the potential for up to four fabs to meet demand over time, as semiconductor growth in electronics, particularly in industrial and automotive markets, is expected to continue well into the future.

“TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers’ demand in the coming decades,” said Rich Templeton, TI’s chairman, president and CEO. “Our commitment to North Texas spans more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community.”

Construction of the first and second fabs is set to begin in 2022.

Production from the first new fab is expected as early as 2025. With the option to include up to four fabs, total investment potential at the site could reach approximately $30 billion and support 3,000 direct jobs over time.

The new fabs will complement TI’s existing 300-mm fabs which include DMOS6 (Dallas, Texas), RFAB1 and the soon-to-be-completed RFAB2 (both in Richardson, Texas), which is expected to start production in the second half of 2022.

Additionally, LFAB (Lehi, Utah), which TI recently acquired, is expected to begin production in early 2023.

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Aishwarya Saxena

A book geek, with creative mind, an electronics degree, and zealous for writing.Creativity is the one thing in her opinion which drove her to enter into editing field. Allured towards south Indian cuisine and culture, love to discover new cultures and their customs. Relishes in discovering new music genres.

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