TI’s New Stackable 18-V input, 35-A PMBus Converter delivers Industry’s Highest Density
Texas Instruments (TI) announces to unveil industry’s highest-density, 18-V input, 35-A synchronous DC/DC buck converter, which offers full differential remote-voltage sensing and PMBus to support telemetry.
Dubbed as TPS546C23 power converter, the new device integrates high- and low-side MOSFETs into a small-footprint package that is significantly denser than competitive devices. Designers are touted to stack two converters in parallel to drive loads up to 70 A for processors in space-constrained and power-dense applications in various markets, including wired and wireless communications, enterprise and cloud computing, and data storage systems.
Key Nuggets
- The highly integrated TPS546C23 power converter is 44-percent denser (amperes per square millimeter) than competitive devices.
- It features 0.5 percent reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors.
- Current sharing enables the stacking of two converters and high efficiency and excellent thermal performance are delivered via the device’s single-pad, stacked die, quad flat no-lead (QFN) package.
- TI also offers the TPS546C20A PMBus converter that supports pin-strapping for both the output voltage and soft-start time.
Key features and benefits
- Integrated low Rdson power MOSFETs support 35 A of continuous output current.
- On-chip PMBus interface and non-volatile memory simplify power-supply design and enable customization.
- Output current, output voltage and internal die temperature telemetry supported via PMBus facilitate active power management.
- Voltage-control mode with clock frequency synchronization and input feed-forward improves EMI/noise and responds rapidly to input-voltage changes.
- Frequency synchronization to an external clock eliminates beat noise and reduces electromagnetic interference (EMI).
TPS546C23 support and tools
Used in conjunction with TI’s WEBENCH online design tools, the TPS546C23 simplifies power conversion and speeds the power-supply design process.
Availability and Pricing
Available now from TI and its authorized distributors, the TPS546C23 is offered in a 40-pin, 5-mm by 7-mm by 1-mm PowerStack QFN package and is priced at US$4.62 in 1,000-unit quantities. One can order the TPS546C23 evaluation module.