u-blox has released the u-blox MAYA-W2 tri-radio module.
Supporting Wi-Fi 6, Bluetooth® low energy (LE) 5.2, and IEEE 802.15.4 (Thread and Zigbee) on a compact form factor, the module brings Wi-Fi 6 technology to industrial and consumer mass-market applications in industrial automation, smart building & energy management, healthcare, smart home, and many other applications.
“NXP’s recently announced IW612 is the industry’s first tri-radio device for enabling seamless, secure connectivity for smart home and industrial use cases, and is ideally suited for addressing different ecosystems including the new Matter protocol. As an NXP Gold Partner, u-Blox is one of the first companies to leverage this innovative solution for their new MAYA-W2 module – which will help expedite the development of high-performance, commercial end-products that require robust, secure, and reliable connectivity,” says Tom Eichenberg, Sr. Director of Marketing – Connectivity, at NXP® Semiconductors.
“Working with customers, we’ve observed a clear need for secure and reliable Wi-Fi connectivity that goes beyond what Wi-Fi 4 can deliver. MAYA-W2 offers vastly improved Wi-Fi performance, particularly when it comes to handling crowded networks, while also supporting Bluetooth LE 5.2 and Thread. This tri-radio functionality makes it ideal for gateways and bridges in low-power IoT and mesh networks,” says Sebastian Schreiber, Product Manager at u-blox.
MAYA-W2 futureproofs applications with an advanced set of connectivity features. Wi-Fi 6, also referred to as 802.11ax, offers better network efficiency – especially in congested areas, lower latency, and improved range over previous generation Wi-Fi standards.
Thread paves the way for low power, IP-based mesh networks commonly used in home automation.
MAYA-W2 is designed to give developers a fast track to the market. All required Linux, Android, and FreeRTOS software drivers are available as open source.
The FreeRTOS software drivers are pre-integrated into the MCUXpresso software development kit (SDK), while the Android and Linux software drivers are pre-integrated into the board support packages (BSPs) for NXP’s i.MX application processors. This reduces design efforts, simplifying software integration and testing.
Product developers can easily evaluate the hardware using dedicated evaluation kits (EVKs) as well as M.2 cards that connect seamlessly to host platforms including the latest range of NXP’s i.MX development boards.