Vishay to showcase Leading High-Frequency MLCCs, Wire-Bondable and Surface-Mount Resistors, and Custom Substrates at IMS2016

Vishay Intertechnology announces its technology lineup for the 2016 IEEE MTT International Microwave Symposium (IMS2016) May 22-27 at Moscone Center in San Francisco. In booth 722, the company will be highlighting its latest cutting-edge high-frequency multilayer ceramic chip capacitors (MLCCs); surface-mount and wire-bondable thin film products; and custom substrates.

Manufactured in noble metal electrode (NME) technology with a wet build process, Vishay Vitramon high-frequency MLCCs feature Q > 2000, ultra-low ESR, and tight capacitance tolerance down to ± 0.05 pF, and they are available with lead (Pb)-free, lead (Pb)-bearing, and non-magnetic copper terminations. In booth 722, QUAD high-power devices in the 0505, 1111, 2525, and 3838 case sizes will be on display. The MLCCs are optimized for a wide range of high-frequency RF applications, including MRI coils and generators, RF instrumentation, and impedance matching networks.

Also Vishay Vitramon’s surface-mount MLCCs in the 0402, 0603, and 0805 case sizes, which offer an extended operating temperature range from -55 °C to +200 C and an ultra-stable dielectric material with an excellent aging rate of 0 % per decade. The devices are designed to reduce signal loss and energy consumption in applications such as VoIP networks, cellular base stations, and satellite, Wi-Fi (802.11), and WiMAX (802.16) wireless communication.

Additonally, Vishay Dale Thin Film will be highlighting a wide range of precision thin film resistor chips and networks, including devices with high-frequency performance to 40 GHz; high power ratings to 6 W; low TCR of 25 ppm/°C; and tolerances of 0.1 %. Vishay Electro-Films (EFI) will feature thin film tantalum nitride microwave resistors in the 0402 and 0201 case sizes. Featuring an alumina substrate, resistance ranges from 20 Ω to 20 kΩ, and microwave resistance ranges from 20 Ω to 1 kΩ, the devices are ideal for amplifiers, oscillators, attenuators, and couplers. In addition, wire-bondable thin film 50 Ω micro-strip transmission lines will be on display for test and measurement applications, high-frequency hybrid assemblies, and RF bread-boarding.

Vishay EFI will also highlight custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, the substrates feature a plate thickness up to 0.050 in. and minimum line and width gap of 0.003 in. with a tolerance down to ± 0.001 in., and they are available in a variety of metal systems.

Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, interactive forums, workshops, short courses, and panel sessions covering a wide range of topics, including wireless communication, RF technologies, microwave electronics and applications, and more.