World’s First Ultra-Compact Baseband Amplifier IC Module
NTT Corporation has succeeded in developing an ultra-compact baseband amplifier IC module with an ultra-broadband performance of 100GHz.
This technology is expected to be used in future all-photonics networks, namely IOWN and 6G, and fields achieving cutting-edge measurements since they will require an ultra-broadband signal amplification function4 rid of distortion.
To achieve this breakthrough, NTT applied its InP-based hetero junction bipolar transistor (InP HBT) technology to improve the performance of amplifier ICs and package mounting technology to incorporate a DC block function2 with 100 GHz bandwidth performance, realizing the world’s first ultra-compact amplifier IC module. In addition, since NTT’s development has a built-in DC block function and is ultra-compact, it can be directly connected to various devices, making it a highly usable module.
This result will enable ultra-high-speed optical communication in the next-generation IOWN network and cutting-edge measurement applications. Details of this technology were published online in IEEE Microwave and Wireless Technology Letters on Feb. 16, 2023.
The COVID-19 pandemic has accelerated the digital transformation of various services, so online communication traffic is exploding. NTT’s core optical network, IOWN, will require transmission speeds of more than 2 terabits per second and a baseband amplifier IC module that can amplify the signal. In addition, in the areas of experimentation and measurement that support such advanced research, there is already a need for ultra-broadband and compact electric amplifiers, and the demand is increasing.
To date, NTT has developed a prototype of an ultra-broadband baseband amplifier IC module with a 1mm coaxial connector and has conducted the world’s first demonstration experiment of optical transmission exceeding 2 terabits per second5. However, previous prototype modules were large and required external DC block parts to connect to the front and rear devices.
By increasing the performance of amplifier ICs using InP HBT technology and advancing package mounting technology, NTT succeeded in realizing the world’s first ultra-compact amplifier IC module that achieves both ultra-wideband performance of 100 GHz and DC block function integration
